Additive manufacturing (AM) has the potential to change the entire manufacturing enterprise by 2030. Substantial progress has been made in recent years; however, there are several remaining challenges such as the high cost of feedstocks, repeatability and reliability issues with AM processes/products, and lack of accelerated simulation packages that have hindered the widespread industry adoption.
The NSERC/CFI Holistic Innovation in Additive Manufacturing (HI-AM) Network has been conceived to work on innovative solutions to address these challenges and to equip Canada for the era of Industry 4.0 and “digital-to-physical conversion.”
The University of Waterloo hosts the NSERC HI-AM Network, bringing together nineteen leading experts from seven universities across Canada.
HI-AM Conference 2019: June 26-27, 2019 – Vancouver
Third BoD Meeting: Nov, 2018
Second SAC Meeting: Sept 25, 2018
SAC evaluation for Jan-June 2018 period due date: Sept 21, 2018